Semiconductors generally possess less electrical conductivity at normal temperatures than those of conductors. They are more conductive than those of insulators. The semiconductor package is then semiconductor wafer is cut, the small wafer cut out using a desktop dispenser and product framework in bonding, even small wafer bonding pads for dispensing glue dispensing function and frame pin end composed of semiconductor components in whole, plastic a good package, the final test and inspection, this is the whole package process. The accuracy of dispensing is beginning to be displayed in the quantitative accuracy. For example, the error of 0.01 grams of glue is a tiny error when we don't think about the size of the product, which is unavoidable in manual dispensing. If the product with special requirements for dispensing density, the error of 0.01 grams is usually very serious, because the product of dispensing is very small and very precise. After the accurate setting of the pressure and the time of the glue, the quality of the product is much better than that of the hand glue.