Semiconductors generally possess less electrical conductivity at normal temperatures than those of conductors. They are more conductive than those of insulators. The semiconductor package is then semiconductor wafer is cut, the small wafer cut out using a desktop type dispenser and product framework in bonding, even small wafer bonding pads for dispensing glue dispensing function and frame pin end composed of semiconductor components in whole, plastic a good package, the final test and inspection, this is the whole package process. With the rapid development of automation technology, the traditional dispensing machine is gradually to keep up with the production process requirements, the need for a performance of production, not only to complete and efficient operation, high quality glue dispensing, and can automatically control, automatic glue on the glue volume is more uniform, will not lead to waste of glue have a lot of functions, is a desktop type dispenser, a great solution for now recruitment difficult situation, dispensing function of more than one person to operate a complete batch production mode, greatly reduce the labor cost of spending.