Semiconductors generally possess less electrical conductivity at normal temperatures than those of conductors. They are more conductive than those of insulators. The semiconductor package is then semiconductor wafer is cut, the small wafer cut out of the use of large precision dispensing machine and LED product framework in bonding, but also the small wafer bonding pad with a dispenser dispensing function with glue and the pin of the frame to a semiconductor element in integrity. Plastic packaging, final test and inspection, this is the whole package process. Because the bulb appearance is elliptical, ordinary dispensing technology is difficult to carry out fixed dispensing, working plane LED large precision dispenser has a plurality of three-dimensional circular slot, can accommodate a plurality of bulbs of glue coating, through the automatic dispensing cycle can ensure the glue evenly in the bulb is coated on the dispensing work LED large precision dispensing machine supports different paths, strict implementation of high precision dispensing path according to the program, the work cycle mode to ensure LED bulb production efficiency, the demand for human resource is low, can improve the production efficiency of manufacturers.