Using SMT surface patch packaging technology process
作者:点胶技术分析 日期:2017-12-09 10:46 浏览:
In the manufacturing process of some products, it is necessary to use SMT surface mount technology to finish the manufacture of products. So we have to use SMT patch to encapsulate LED dispensing machine to help products complete production. Then the SMT surface patch packaging technology will be used to encapsulate the product.
The process of SMT surface patch technology is divided into five steps: glue, patch, welding, inspection and rework. And the SMT patch encapsulates the LED dot glue machine to take part in the process. It is to use the glue machine to use the solder paste, and the SMT patch components and the POC circuit board are glued.
The solder paste used by the glue dispenser is a kind of glue which is mainly used for welding of various electronic products. Therefore, when the bonding between SMT patch and POC circuit board is finished, solder paste can be melted away by welding, making bonding between SMT patch and POC circuit board more reliable and reliable.
Finally, we should use some testing instruments and equipments, such as microscope and magnifying glass to check the quality of POC circuit board and the accuracy of SMT patch welding. If there is no quality problem, we even finish the MT surface patch package. If we find in the inspection process the quality of the POC circuit boards which are not in good quality, the SMT patch welding is not strong enough, so we have to rework, or even re use the SMT patch to encapsulate the LED dispensing machine to do the dispensing.
